- RS Stock No.:
- 489-6079
- Mfr. Part No.:
- MBH29001-28W/2.6
- Manufacturer:
- Malico
147 In Global stock for delivery in 4-6 working days, delivery time may vary for certain locations or FTZ
Added
Price Each
MYR45.48
| Units | Per Unit |
| 1 - 99 | MYR45.48 |
| 100 - 249 | MYR44.52 |
| 250 - 499 | MYR43.18 |
| 500 + | MYR41.89 |
- RS Stock No.:
- 489-6079
- Mfr. Part No.:
- MBH29001-28W/2.6
- Manufacturer:
- Malico
Legislation and Compliance
- COO (Country of Origin):
- TW
Product Details
BGA Chipset Heat Sinks
High-performance precision-forged clip-attachment heatsinks for BGA chipsets.
AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
BGA Heatsinks
Specifications
Attribute | Value |
|---|---|
| For Use With | Clip |
| Length | 29mm |
| Width | 29mm |
| Height | 28mm |
| Dimensions | 29 x 29 x 28mm |
| Mounting | Clip |
| Colour | Black |