Heatsink, BGA, 4K/W, 80 x 58.6 x 36mm, Screw

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): CN
Product Details

CCI Chipset Heatsink

Aluminium heatsink solutions suitable for variety of BGA packages. Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability.

Mechanical fixing (variation between heat sinks)
Developed for mass production and high volume applications, where combination of cost and performance is critical
Integrated interface material (check heat sink) for complete solution
Ideally suited for both natural and forced convection

BGA Heatsinks

Specifications
Attribute Value
For Use With Universal Square Alu
Length 80mm
Width 58.6mm
Height 36mm
Dimensions 80 x 58.6 x 36mm
Thermal Resistance 4K/W
Mounting Screw
Package Type BGA
140 In Global stock for delivery within 4 - 6 working days
Price Each
MYR 15.98
units
Per unit
1 - 9
MYR15.98
10 - 24
MYR15.71
25 - 49
MYR15.25
50 - 99
MYR14.96
100 +
MYR14.73
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