TE Connectivity 2.54mm Pitch Vertical 6 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): CH
Product Details

TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Augat 500 Series

PCB DIP sockets with stamped and formed contacts in a thermoplastic closed frame insulator. These PCB DIP sockets have a 2.54mm centerline with a 7.62 mm row spacing. The contacts of these PCB DIP IC sockets are gold plated with 4 fingered mating.

Specifications
Attribute Value
Number of Contacts 6
Mounting Type Through Hole
Pin Type Stamped
Pitch 2.54mm
Row Width 7.62mm
Frame Type Open Frame
Termination Method Solder
Contact Plating Gold over Nickel
Current Rating 3A
Orientation Vertical
Length 50.8mm
Width 4.57mm
Depth 17.78mm
Dimensions 50.8 x 4.57 x 17.78mm
Housing Material PCT
Maximum Operating Temperature +105°C
Minimum Operating Temperature -55°C
Contact Material Beryllium Copper
350 In Global stock for delivery within 4 - 6 working days
Price Each (In a Pack of 5)
MYR 7.48
units
Per unit
Per Pack*
5 - 120
MYR7.48
MYR37.40
125 - 370
MYR7.142
MYR35.71
375 - 995
MYR6.926
MYR34.63
1000 - 1995
MYR6.78
MYR33.90
2000 +
MYR6.646
MYR33.23
*price indicative
Packaging Options: