TE Connectivity Backplane Connector Through Hole Socket, Press-In Termination

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.

Specifications
Attribute Value
Plug/Socket Socket
Gender Female
Mounting Type Through Hole
Termination Method Press-In
Contact Material Phosphor Bronze
Housing Material PET
Contact Plating Gold over Palladium Nickel over Nickel
Temporarily out of stock - back order for despatch 18/12/2019, delivery within 4 working days from despatch date
Price Each
MYR 24.17
units
Per unit
1 - 19
MYR24.17
20 - 74
MYR23.18
75 - 299
MYR22.42
300 - 599
MYR21.92
600 +
MYR21.48
Packaging Options:
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