Z-PACK™ HM-Zd headers and connector assemblies with a 2.50mm centerline. These Z-PACK™ HM-Zd Pin headers and receptacle connector assemblies are press fit PCB through hole mounting and have polyester GF housings.
HM-Zd is the backplane interconnect for PICMG 3.x (ATCA) industry standard
High speed, differential, board to backplane electrical connectors
Provides a differential solution for applications in the range 3 to 6.4 Gb/s
Extension of IEC61076-4-101
PICMG
The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.
Attribute | Value |
---|---|
Backplane Connector Type | High Speed Hard Metric, 2 Pair |
Number of Contacts | 40 |
Number of Columns | 10 |
Number of Rows | 4 |
Body Orientation | Straight |
Housing Material | PE |
Pitch | 2.5mm |
Mounting Type | Through Hole |
Contact Material | Phosphor Bronze |
Contact Plating | Gold over Nickel |
Current Rating | 700mA |
Voltage Rating | 250 V ac |
Termination Method | Press-In |
Series | Z-PACK HM-Zd |
Maximum Operating Temperature | +105°C |
Minimum Operating Temperature | -65°C |