Solder Pastes

Solder paste is a type of solder used when manufacturing PCBs to connect surface mount components to pads on the board. The paste is a mixture of small solder spheres with flux.The paste initially adheres components in place because of its stickiness. You then use heat to melt the paste to form a mechanical bond and an electrical connection.Solder paste is applied to the board by stencil printing and the components are put in place by a pick and place machine or by hand.Why use a solder paste?Defects in circuit-board assembly are caused due to issues in the solder-paste printing process or due to defects in the solder paste. This can give short circuits, incomplete circuits, and head on pillow defects.How to use Solder paste Remove oil, grease, polishing compound and any excessive oxides from the joint. Make sure that the joint is smooth, flat and free from any burs. Apply the solder paste to the top joint. The paste will not fill large gaps so make sure that the pieces to be soldered actually touch. Apply heat to the piece away from the joint, keep the heat source moving too prevent overheating the paste. Once the paste flows remove the heat sourceTypical ApplicationsSolder pastes are used in mass production of PCBs and prototype PCB assembly.

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Description Price Lead Free Trade Name Package Type Package Size
RS Stock No. 835-2699
Mfr. Part No.SKU-0018
MYR54.66
Each
units
- Electric Paint Pen 10ml
RS Stock No. 506-4302
Mfr. Part No.698840
BrandMulticore
MYR606.76
Each
units
Yes - Tub 500g
RS Stock No. 555-232
Mfr. Part No.GEL FLUX MOB 39 - SERINGUE DE 10CC
BrandMBO
MYR100.02
Each
units
- - Syringe 10cm³
RS Stock No. 835-2693
Mfr. Part No.SKU-0216
MYR152.11
Each
units
- Electric Paint Jar 50ml
RS Stock No. 832-9775
Mfr. Part No.1817240
BrandHenkel
MYR382.23
Each
units
Yes Loctite HF212 SAC0307 AGS Jar 500g
RS Stock No. 832-9766
Mfr. Part No.1817229
BrandHenkel
MYR463.62
Each
units
Yes Loctite HF212 97SC AGS Jar 500g
RS Stock No. 832-9750
Mfr. Part No.1791137
BrandHenkel
MYR580.66
Each
units
Yes Loctite HF212 97SC DAP Jar 500g
RS Stock No. 146-6199
Mfr. Part No.SMDLTLFP
BrandCHIPQUIK
MYR90.58
Each
units
Yes - Syringe 15g
RS Stock No. 146-2876
Mfr. Part No.4902P-15G
MYR91.21
Each
units
Yes - Syringe 15g
RS Stock No. 146-6200
Mfr. Part No.SMDLTLFP10T5
BrandCHIPQUIK
MYR173.54
Each
units
Yes - Syringe 35g
RS Stock No. 146-6195
Mfr. Part No.SMD291SNL250T3
BrandCHIPQUIK
MYR277.98
Each
units
Yes - Jar 250g
RS Stock No. 146-6187
Mfr. Part No.SMD291AX
BrandCHIPQUIK
MYR77.47
Each
units
- - Syringe 15g
RS Stock No. 146-6191
Mfr. Part No.SMD291AX50T3
BrandCHIPQUIK
MYR85.37
Each
units
- - Jar 50g
RS Stock No. 146-6188
Mfr. Part No.SMD291AX10
BrandCHIPQUIK
MYR104.67
Each
units
- - Syringe 35g
RS Stock No. 146-6198
Mfr. Part No.SMD4300SNL10
BrandCHIPQUIK
MYR139.00
Each
units
Yes - Syringe 35g
RS Stock No. 146-6197
Mfr. Part No.SMD4300AX10
BrandCHIPQUIK
MYR118.75
Each
units
- - Syringe 35g
RS Stock No. 146-2877
Mfr. Part No.4902P-25G
MYR121.74
Each
units
Yes - Syringe 25g
RS Stock No. 146-6194
Mfr. Part No.SMD291SNL10T5
BrandCHIPQUIK
MYR194.50
Each
units
Yes - Syringe 35g
RS Stock No. 146-6193
Mfr. Part No.SMD291SNL10
BrandCHIPQUIK
MYR126.54
Each
units
Yes - Syringe 35g
RS Stock No. 146-6192
Mfr. Part No.SMD291SNL
BrandCHIPQUIK
MYR82.19
Each
units
Yes - Syringe 15g
Related Products
Tack Flux supplied in 6 2cc Squeeze Tubes ...
Description:
Tack Flux supplied in 6 2cc Squeeze Tubes (same flux as SMD291). Low viscosity no-clean synthetic paste flux. Has a pleasant odor. Ideal for all rework, solder, de-solder and reflow applications Non-corrosive, non-conductive, no-clean Tack flux will not run all ...
Solder Paste no clean Lead-Free in 10cc syringe ...
Description:
Solder Paste no clean Lead-Free in 10cc syringe T5 Mesh SAC305. Printing speeds up to 100mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesDispense gradeCompatible with enclosed print headsPasses BONO test @1.56%RoHS II and REACH compliant. ...
Solder Paste in jar 250g (T3) Sn42/Bi57.6/Ag0.4 Low ...
Description:
Solder Paste in jar 250g (T3) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F. Printing speeds up to 100mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesPrint gradeCompatible with enclosed print headsRoHS II and REACH ...
Touch Board, Pi Cap, electrical components, prototyping materials, ...
Description:
Touch Board, Pi Cap, electrical components, prototyping materials, PCBs, micro controllers, Arduino, Raspberry Pi, MaKey MaKey and e‐textiles. Use with the Touch Board or Pi Cap to make touch sensors. Conducts electricity when dryPaint, stencil or screen printAir­‐dryingNontoxic and solvent ...