Potting Compounds

Potting compounds are a general-purpose types of sealant that can offer environmental, mechanical and physical protection to circuit boards and electronic assemblies. Used in electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound, once applied, cured and hardened encases your electronics in a solid mass providing a barrier which provides protection from moisture, vibration, thermal or physical shock and general contamination. The mechanical protection enables the components to maintain high performance under extreme conditions. Thermosetting plastics or silicone rubber gels are often used.

Types of compounds

Epoxy Potting Compounds - Epoxy potting compounds generally perform as a better adhesive, high temperature resistance, and chemical resistance. Epoxy systems have better adhesion to a wide variety of substrates and typically do not need primers. They are easy to use and are predictable. They have good high temperature resistance up to 400°F.

Urethane Potting Compounds - Urethane potting compounds generally have better flexibility, elongation, and abrasion resistance. Since they can have Tg below -40°C they are an excellent selection for SMT PC board potting. Their gel time can be easily changed with an accelerator without changing the properties.

Silicone Potting Compounds - Silicone potting compounds and encapsulating materials are also soft, flexible, and have better elongation. Silicone materials also provide the widest operating temperatures. Specially formulated silicone potting compounds can operate at below -100°C and most silicone materials can handle 200°C temperatures.

Acrylic Potting Compounds - Acrylic potting compounds are UV and heat hardening materials. They benefit from very fast hardening, adequate chemical resistance and are clear in appearance.

Applications of Potting Compounds

Potting compounds are used in a range of applications such as;

  • Military
  • Industrial
  • Automotive industry
  • PCB's
  • Coils

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Description Price Trade Name Product Material Package Type Package Size Special Properties Cure Time Hardness Thermal Conductivity Colour Maximum Operating Temperature Minimum Operating Temperature Chemical Composition Dielectric Strength Odour
RS Stock No. 192-7566
Mfr. Part No.8820-375ML
MYR400.17
Each
units
- PUR Bottle 375 ml - 1.5 h @ 80 °C, 2 h @ 65 °C, 48 h @ 22 °C - 0.27W/mK Black +150°C -50°C - 14.9kV/mm -
RS Stock No. 192-7569
Mfr. Part No.9510-30ML
MYR157.38
Each
units
- Epoxy Cartridge 30 ml - 1 h @ 90 °C, 3 h @ 80 °C, 30 min @ 120 °C 84 Shore D 0.3W/mK Black +150°C -65°C - 15.8kV/mm -
RS Stock No. 192-7564
Mfr. Part No.8800-375ML
MYR255.56
Each
units
- PUR Bottle 375 ml - 24 h @ 22 °C, 25 min @ 80 °C, 30 min @ 65 °C 74 Shore A 0.32W/mK Black +125°C -50°C - 14.6kV/mm -
RS Stock No. 192-7565
Mfr. Part No.8810-375ML
MYR209.97
Each
units
- PUR Bottle 375 ml - 1 h @ 65 °C, 24 h @ 22 °C, 45 min @ 80 °C 80 Shore D 0.25W/mK Black +125°C -50°C - 16kV/mm -
RS Stock No. 192-7570
Mfr. Part No.9510-300ML
MYR402.84
Each
units
- Epoxy Cartridge 300 ml - 1 h @ 90 °C, 3 h @ 80 °C, 30 min @ 120 °C 84 Shore D 0.3W/mK Black +150°C -65°C - 15.8kV/mm -
RS Stock No. 192-7567
Mfr. Part No.9410-3ML
MYR434.83
Each
units
- Epoxy Syringe 3 ml - 1 h @ 90 °C, 7 min @ 150 °C, 30 min @ 100 °C 70 Shore D 1.1 W/mK @ 25 °C, 1.1 W/mK @ 50 °C, 1.2 W/mK @ 100 °C - +145°C -65°C - - -