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Socket, DIP;32Pins;Low Profile;Open;Solder Tail;0.6In.;Beryllium Copper;Tin/Lead
  • MYR10.33
    Each
Socket, DIP;32Pins;Low Profile;Open;Solder Tail;0.6In.;Beryllium Copper;Tin/Lead
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Pin Header; 0.050 in.; 3 A; 0.017 in.; Beryllium Copper; Thermoplastic
  • MYR94.21Each
Pin Header; 0.050 in.; 3 A; 0.017 in.; Beryllium Copper; Thermoplastic
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IC Socket; 52; 0.1 in.; Phosphor Bronze; Tin over Nickel
  • MYR13.91
    Each
IC Socket; 52; 0.1 in.; Phosphor Bronze; Tin over Nickel
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Socket, DIP;Open;8 Pos.;0.100In.cen.;Solder;0.3In.;30muIn. Gold over 50muIn. Nic
  • MYR13.09
    Each
Socket, DIP;Open;8 Pos.;0.100In.cen.;Solder;0.3In.;30muIn. Gold over 50muIn. Nic
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Socket, DIP;16Pins;Low Profile;Open;Solder Tail;0.3In.;Beryllium Copper;Tin/Lead
  • MYR5.24
    Each
Socket, DIP;16Pins;Low Profile;Open;Solder Tail;0.3In.;Beryllium Copper;Tin/Lead
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Socket, DIP;Open;4-Finger;24 Pos.;Solder;0.3In.;30muIn. Gold;50V;3A;-25 to 85deg
  • MYR19.62
    Each
Socket, DIP;Open;4-Finger;24 Pos.;Solder;0.3In.;30muIn. Gold;50V;3A;-25 to 85deg
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ER - Socket, DIP;Open;4-Finger;24 Pos.;Solder;0.4In.;30muIn. Gold;50V;3A;-25 to 85deg
  • MYR97.95
    Each
ER - Socket, DIP;Open;4-Finger;24 Pos.;Solder;0.4In.;30muIn. Gold;50V;3A;-25 to 85deg
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Socket, DIP;Closed;4-Finger;24 Pos.;0.100In.cen.;Solder;0.6In.;30muIn. Gold;0.12
  • MYR13.39
    Each
Socket, DIP;Closed;4-Finger;24 Pos.;0.100In.cen.;Solder;0.6In.;30muIn. Gold;0.12
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IC Socket; 44; 0.05 in.; Phosphor Bronze; Tin over Nickel
  • MYR11.07
    Each
IC Socket; 44; 0.05 in.; Phosphor Bronze; Tin over Nickel
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Socket, DIP;16Pins;3-Level;Open;Solderless Wrapost;0.3In.;Gold;SMD;3A
  • MYR30.73
    Each
Socket, DIP;16Pins;3-Level;Open;Solderless Wrapost;0.3In.;Gold;SMD;3A
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Socket, DIP;Open;4-Finger;20 Pos.;Solder;0.3In.;30muIn. Gold;50V;3A;-25 to 85deg
  • MYR16.36
    Each
Socket, DIP;Open;4-Finger;20 Pos.;Solder;0.3In.;30muIn. Gold;50V;3A;-25 to 85deg
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Socket, DIP;Open;4-Finger;20 Pos.;Solder;0.3In.;30muIn. Gold;50V;3A;-25 to 85deg
  • MYR31.41
    Each
Socket, DIP;Open;4-Finger;20 Pos.;Solder;0.3In.;30muIn. Gold;50V;3A;-25 to 85deg
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IC Socket; 84; 0.1 in.; Phosphor Bronze; Tin over Nickel
  • MYR18.45
    Each
IC Socket; 84; 0.1 in.; Phosphor Bronze; Tin over Nickel
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Socket, DIP;Open;4-Finger;24 Pos.;Solder;0.6In.;Ber. Copper;30muIn. Gold;0.125In
  • MYR7.48
    Each
Socket, DIP;Open;4-Finger;24 Pos.;Solder;0.6In.;Ber. Copper;30muIn. Gold;0.125In
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ER - Socket, DIP;Open;48 Pos.;0.100In.cen.;Solder;0.6In.;30muIn. Gold over 50muIn. Ni
  • MYR113.47
    Each
ER - Socket, DIP;Open;48 Pos.;0.100In.cen.;Solder;0.6In.;30muIn. Gold over 50muIn. Ni
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Socket; Double Row Pin Header; 100; 2 mm; 0.023 mm (Pin 1), 0.019 mm (Pin 2)
  • MYR91.86Each
Socket; Double Row Pin Header; 100; 2 mm; 0.023 mm (Pin 1), 0.019 mm (Pin 2)
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Pin Header; 0.050 in.; 3 A; 0.017 in.; Beryllium Copper; Thermoplastic
  • MYR68.98Each
Pin Header; 0.050 in.; 3 A; 0.017 in.; Beryllium Copper; Thermoplastic
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Socket, DIP;Open;32 Pos.;0.100In.cen.;Solder;0.6In.;30muIn. Gold over 50muIn. Ni
  • MYR17.58
    Each
Socket, DIP;Open;32 Pos.;0.100In.cen.;Solder;0.6In.;30muIn. Gold over 50muIn. Ni
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ER - Socket, DIP;Open;4-Finger;32 Pos.;Solder;PCB;0.6In.;Ber. Copper;30muIn. Gold;3A
  • MYR108.77
    Each
ER - Socket, DIP;Open;4-Finger;32 Pos.;Solder;PCB;0.6In.;Ber. Copper;30muIn. Gold;3A
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Socket, DIP;Open;4-Finger;28 Pos.;Solder;0.3In.;30muIn. Gold;50V;3A;-25 to 85deg
  • MYR22.88
    Each
Socket, DIP;Open;4-Finger;28 Pos.;Solder;0.3In.;30muIn. Gold;50V;3A;-25 to 85deg
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